Paper Title:
Deployable Process Analysis of Packaged SMP Sandwich Beam
  Abstract

Shape memory polymers own many advantages compared with traditional shape memory alloys or ceramics. In order to improve their shape recovery stress and realize a stable recovery response during the deployable process, the structure of SMP sandwich beam composed of two metallic skin and one SMP core is considered. The recovery behaviors of pure SMP and SMP beams reinforced by one-layer metallic skin are also discussed for comparison. The results confirm that the deployable properties of SMP matrix can be significantly improved by using sandwich structure.

  Info
Periodical
Advanced Materials Research (Volumes 123-125)
Edited by
Joong Hee Lee
Pages
943-946
DOI
10.4028/www.scientific.net/AMR.123-125.943
Citation
Z. F. Li, Z. D. Wang, "Deployable Process Analysis of Packaged SMP Sandwich Beam", Advanced Materials Research, Vols. 123-125, pp. 943-946, 2010
Online since
August 2010
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Price
$32.00
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