Analysis of Roughness in Super-High Speed Point Grinding

The technology of super-high speed point (SHSP) grinding will bring in higher precision and productivity for component manufacturing. The surface roughness attained by SHSP grinding is analyzed in this paper based on the contact area and the probability distribution of chip thickness while the swivel angle of α exists, proposing a new method to predicate the value of the roughness, the experiment of SHSP grinding is carried out whether α exists or not to verify the theoretical analysis in the paper, through observing the micro-surface after grinding, the conclusions will be drawn at last.