Paper Title:
Analysis of Roughness in Super-High Speed Point Grinding
  Abstract

The technology of super-high speed point (SHSP) grinding will bring in higher precision and productivity for component manufacturing. The surface roughness attained by SHSP grinding is analyzed in this paper based on the contact area and the probability distribution of chip thickness while the swivel angle of α exists, proposing a new method to predicate the value of the roughness, the experiment of SHSP grinding is carried out whether α exists or not to verify the theoretical analysis in the paper, through observing the micro-surface after grinding, the conclusions will be drawn at last.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
101-106
DOI
10.4028/www.scientific.net/AMR.126-128.101
Citation
Y. M. Liu, Y. D. Gong, J. Cheng, T. C. Han, "Analysis of Roughness in Super-High Speed Point Grinding", Advanced Materials Research, Vols. 126-128, pp. 101-106, 2010
Online since
August 2010
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Price
$32.00
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