Paper Title:
Surface Texture Analysis of Fixed and Free Abrasive Machining of Silicon Substrates for Solar Cells
  Abstract

Multi-wire sawing process has been widely used for wafer slicing of silicon substrates for solar cells. Usually there are two different kinds of wire saw in multi-wire sawing process including free abrasive wire sawing with SiC grits and fixed abrasive wire sawing with diamond wire. For free abrasive wire sawing process, the material removal mechanism can be considered as lapping and the fixed abrasive wire sawing can be considered as grinding. This paper is to investigate the characteristics of the surface texture of silicon substrate fabricated by these two wire sawing process. Experimental results have been observed by white light interferometry and SEM. Some different properties of both processes have compared been with variant characteristics including 2-D and 3-D surface roughness parameters. Results of this paper can be further used to evaluate the feasibility of wire sawing process of silicon substrates for solar cells.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
177-180
DOI
10.4028/www.scientific.net/AMR.126-128.177
Citation
C. C. A. Chen, P. H. Chao, "Surface Texture Analysis of Fixed and Free Abrasive Machining of Silicon Substrates for Solar Cells", Advanced Materials Research, Vols. 126-128, pp. 177-180, 2010
Online since
August 2010
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Price
$32.00
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