Paper Title:
Machining Schemes for Dicing Soda Lime Glass
  Abstract

This research investigates machining schemes for dicing soda lime glass in order to reduce the damage in the processes. Ductile machining and brittle machining of glass are first analyzed based on fracture mechanics and then verified by experiments. Experiments with various machining schemes including scribing-then-breaking, direct-dicing and dicing-then-breaking processes for soda lime glass are then conducted. Experimental observations showed the following results. (i) The critical depth of cut (CDOC) for soda lime glass is between 0.4μm and 0.8μm that matches theoretical prediction, 0.78μm, based on fracture analysis. (ii) The scribing-then-breaking machining scheme results in less damage than the regular slicing process. The DOC of scribing, however, must be in the ductile-brittle region to achieve this result. (iii) Defect due to dicing on the back surface is higher than that on the front surface in one-step dicing through process. Dicing defects can be effectively reduced by decreasing the feed rate or increasing the dicing speed.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
263-268
DOI
10.4028/www.scientific.net/AMR.126-128.263
Citation
J. C. Tsai, H. S. Chen, "Machining Schemes for Dicing Soda Lime Glass", Advanced Materials Research, Vols. 126-128, pp. 263-268, 2010
Online since
August 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Seong Min Lee
Abstract:Semiconductor devices are usually formed on a single silicon wafer during a batch processing method. Individual devices are separated from...
485
Authors: Y. Hasuda, Y. Suzuki, T. Kato, R. Meguriya, T. Furusawa, T. Ohashi
Abstract:High density and isotropic poreless structure of Glass-like-carbon makes it practically used for fuel cells of space-shuttles and hard disk...
65
Authors: Shahrum Abdullah, Z. Endut, I. Ahmad, Azman Jalar, Suhaila M. Yusof
Abstract:Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level...
202
Authors: Mao Lu Wang, Yang Wang, Lei Qin, Jian Guan
Chapter 1: Materials Science and Engineering
Abstract:Sapphire is an important wide bandgap semiconductor material for developing UV/blue optoelectronic devices, however because of its high...
147
Authors: Mao Lu Wang, Lei Qin, Yang Wang, Ming Zhou
Chapter 1: Advanced Design Technology
Abstract:The Processing advantages of UV laser were discussed in this paper. A series of experiments were carried out, some good results was achieved,...
90