Paper Title:
Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer
  Abstract

As a new fixed-abrasive machining method, chemo-mechanical grinding (CMG) is developed from chemical mechanical polishing (CMP), with the obvious advantage of geometric accuracy determinacy and no slurry. To improve material removal rate and enhance the popularity of CMG, this paper introduces a combined grinding method, i.e., two dimensional ultrasonic vibration assisted CMG (2D-UACMG). Si wafer is taken as the workpiece and the influence of ultrasonic vibration modes and process parameters on the surface roughness and the material removal is examined. The results show 2D-UACMG can obtain better surface quality with little surface damage at nanometer level compared with the conventional CMG without the ultrasonic vibration.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
282-288
DOI
10.4028/www.scientific.net/AMR.126-128.282
Citation
Z. Z. Wang, Y. B. Wu, L. B. Zhou, Y. B. Guo, C. X. Wu, "Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer", Advanced Materials Research, Vols. 126-128, pp. 282-288, 2010
Online since
August 2010
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Price
$32.00
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