Paper Title:
Machining Force and Modes for Si Wafer Machining with Rotational Tool
  Abstract

In this study, basic experiments involving machining using a rotational tool were conducted with the aim of increasing the volume of material removed rate in ductile-mode machining of Si wafers. The machining surface and machining force was compared to experimentally clarify the material removal process for a single cutting edge, the critical cutting thickness tc at which occurs of cracks was set as the machining condition. Then, the three machining modes were experimentally revealed. As the result, the ductile-mode machining surface was obtained that the total depth of cut was under less than 78.5μm on ductile-brittle-mode machining.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
289-294
DOI
10.4028/www.scientific.net/AMR.126-128.289
Citation
N. Yokemura, K. Imai, H. Hashimoto, "Machining Force and Modes for Si Wafer Machining with Rotational Tool", Advanced Materials Research, Vols. 126-128, pp. 289-294, 2010
Online since
August 2010
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Price
$32.00
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