Fused silica is an important material for optics of ultraviolet laser transmission. It is difficult to be ground in ductile mode because of a high brittleness. In this paper, ductile mode grinding was achieved by a taper grinding method when the initial surface was a polished surface. However, when the initial surface was an unpolished surface, ductile mode grinding could not be realized because of the existence of surface and subsurface damages. The damages on the ground fused silica surface were repaired by CO2 laser irradiation with optimal laser power and scanning velocity. The optimal parameters were determined by studying the viscosity of fused silica and etching depth of laser irradiated groove. Besides laser processing parameters, surface roughness of laser irradiated surface is also greatly influenced by the initial surface roughness.