Paper Title:
Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
  Abstract

This paper investigates the effects of some chemical factors on the material removal rate (MRR) in chemo-mechanical polishing (CMP) of Si (100) wafers. The CMP was carried out in alkaline slurry using alumina and ceria particles with hydrogen peroxide. When using the alumina particles, the MRR initially decreases with increasing the slurry pH value until pH = 9. Nevertheless, the application of the ceria particles increases the MRR before the pH of the slurry reaches 10. A higher slurry flow rate brings about a greater MRR.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
511-514
DOI
10.4028/www.scientific.net/AMR.126-128.511
Citation
Y. G. Wang, L. C. Zhang, A. Biddut, "Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers", Advanced Materials Research, Vols. 126-128, pp. 511-514, 2010
Online since
August 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Cong Rong Zhu, Bing Hai Lv, Ju Long Yuan
Abstract:Studies on chemical mechanical polishing (CMP) for silicon nitride (Si3N4) balls with CeO2 abrasive carried to investigate the mechanism of...
131
Authors: Cheng Yong Wang, M.D. Chen, P.X. Yang, Jing Ming Fan
Abstract:Abrasive Suspension Jets (ASJ) is a new micro processing technique developed for micro processing of hard and brittle materials based on the...
381
Authors: Sheng Li Wang, Zhen Xia Li, Hui Lai Mu, Yu Tian, Li Bing Yang
Abstract:Chemical mechanical polishing (CMP) is the effective technology which obtains high accuracy surface of hard disk substrate with...
3067
Authors: Heng Zhen Dai, Zhu Ji Jin, Shang Gao, Z.C. Tao
Chapter 1: Grinding Technology
Abstract:Aiming at the severe surface/subsurface damage of Al2O3ceramic ground by diamond grinding wheel, the...
270
Authors: Jian Xiu Su, Jia Xi Du, Xing Long Liu, Hai Na Liu
Abstract:SiC crystal substrate has been widely used in the area of microelectronics, photonics and new materials, such as semiconductor lighting,...
250