Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers |
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| Journal | Advanced Materials Research (Volumes 126 - 128) |
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| Volume | Advances in Abrasive Technology XIII |
| Edited by | Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso |
| Pages | 511-514 |
| DOI | 10.4028/www.scientific.net/AMR.126-128.511 |
| Citation | Yong Guang Wang et al., 2010, Advanced Materials Research, 126-128, 511 |
| Online since | August, 2010 |
| Authors | Yong Guang Wang, Liang Chi Zhang, Altabul Biddut |
| Keywords | Alumina, Ceria, Chemo-Mechanical Polishing, pH, Removal Rate |
| Abstract | This paper investigates the effects of some chemical factors on the material removal rate (MRR) in chemo-mechanical polishing (CMP) of Si (100) wafers. The CMP was carried out in alkaline slurry using alumina and ceria particles with hydrogen peroxide. When using the alumina particles, the MRR initially decreases with increasing the slurry pH value until pH = 9. Nevertheless, the application of the ceria particles increases the MRR before the pH of the slurry reaches 10. A higher slurry flow rate brings about a greater MRR. |
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