Paper Title:
Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding
  Abstract

Two grinding methods, parallel grinding and cross grinding, were applied to the horizontal-axis-type rotary surface grinding of silicon and tungsten carbide. It was found that the cross grinding method results in better ground surface roughness than parallel grinding for the silicon wafer and that an isotropic ground surface topography is achieved for both silicon and tungsten carbide by cross grinding.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
579-584
DOI
10.4028/www.scientific.net/AMR.126-128.579
Citation
A. Kubo, J. Tamaki, A.M.M. Sharif Ullah, "Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding", Advanced Materials Research, Vols. 126-128, pp. 579-584, 2010
Online since
August 2010
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Price
$32.00
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