Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding |
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| Journal | Advanced Materials Research (Volumes 126 - 128) |
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| Volume | Advances in Abrasive Technology XIII |
| Edited by | Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso |
| Pages | 579-584 |
| DOI | 10.4028/www.scientific.net/AMR.126-128.579 |
| Citation | Akihiko Kubo et al., 2010, Advanced Materials Research, 126-128, 579 |
| Online since | August, 2010 |
| Authors | Akihiko Kubo, Junichi Tamaki, A.M.M. Sharif Ullah |
| Keywords | Cross Grinding, Ground Surface Topography, Horizontal-Axis-Type Rotary Surface Grinding, Parallel Grinding, Silicon Wafer, Tungsten Carbide |
| Abstract | Two grinding methods, parallel grinding and cross grinding, were applied to the horizontal-axis-type rotary surface grinding of silicon and tungsten carbide. It was found that the cross grinding method results in better ground surface roughness than parallel grinding for the silicon wafer and that an isotropic ground surface topography is achieved for both silicon and tungsten carbide by cross grinding. |
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