Paper Title:
A Study on Pressure Stability in Double-Sided Polishing Process
  Abstract

How to achieve the precision double-sided polishing process is a important issue for wafer manufacturing, it depends on machining condition such as machining environment, polishing speed, polishing operation mode, polishing pressure, polishing fluid etc. The key factor to the wafer surface quality is the stability of the polishing pressure. This paper analyzes the impact of double-sided polishing pressure in polishing process, using AMESim software to simulate the pressure standard deviation’s changes under diffrent polishing pressures, and carries out some experiments to identify the impact of polishing parameters (such as the ring gear ratio, polishing speed, polishing pressure) to the polishing pressure stability and the wafer surface quality.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
64-69
DOI
10.4028/www.scientific.net/AMR.126-128.64
Citation
W. Li, C. Jin, X. Z. Hu, "A Study on Pressure Stability in Double-Sided Polishing Process", Advanced Materials Research, Vols. 126-128, pp. 64-69, 2010
Online since
August 2010
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Price
$32.00
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