Paper Title:
A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers
  Abstract

A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
707-712
DOI
10.4028/www.scientific.net/AMR.126-128.707
Citation
J. Zhang, B. Liu, M. Qian, X. L. Zhu, R. K. Kang, "A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers", Advanced Materials Research, Vols. 126-128, pp. 707-712, 2010
Online since
August 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: G.J. Qu, Min Qian, J. Zhang, Q. Xing
Abstract:The purpose of this paper is to show the investigation on a type of unitary piezoelectric four-component cutting dynamometer. Based on...
93
Authors: Xiang Long Zhu, Ren Ke Kang, Yong Qing Wang, Dong Ming Guo
Abstract:Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is...
361
Authors: Cai Wei Xiao, Hui Ding, Wen De Li, Kai Cheng
Abstract:In this paper, a novel sensing cutting tool for precision turning is presented, which has a self-sensing function to monitor the cutting...
373
Authors: Jun Zhang, Yin Bai, Min Qian
Chapter 7: Other Novel Technologies and Advanced Studies
Abstract:Grinding force is strongly related to grinding process, and the application of dynamometer for its measurement during machining is essential...
603
Authors: Chang Yin Gao, Wan Quan Li
Chapter 1: Mechanical Engineering
Abstract:In order to accomplish the static calibration of piezoelectric dynamometer, the principle and structure of a multifunctional high-precision,...
3