Paper Title:
Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
  Abstract

The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of the wafer lapped with a uniform pattern pad and that with an optimized pattern was compared. Results show that the PV value of the latter is lower that of the former.

  Info
Periodical
Advanced Materials Research (Volumes 126-128)
Edited by
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Pages
82-87
DOI
10.4028/www.scientific.net/AMR.126-128.82
Citation
M. Li, Y. W. Zhu, J. Li, J. F. Ye, J. L. Fan, "Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad", Advanced Materials Research, Vols. 126-128, pp. 82-87, 2010
Online since
August 2010
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Price
$32.00
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