Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad |
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| Journal | Advanced Materials Research (Volumes 126 - 128) |
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| Volume | Advances in Abrasive Technology XIII |
| Edited by | Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso |
| Pages | 82-87 |
| DOI | 10.4028/www.scientific.net/AMR.126-128.82 |
| Citation | Mao Li et al., 2010, Advanced Materials Research, 126-128, 82 |
| Online since | August, 2010 |
| Authors | Mao Li, Yong Wei Zhu, Jun Li, Jian Feng Ye, Ji Long Fan |
| Keywords | Fixed Abrasive Pad (FAP), Flatness, Optimized Pattern, Trajectory Density, Wear |
| Abstract | The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of the wafer lapped with a uniform pattern pad and that with an optimized pattern was compared. Results show that the PV value of the latter is lower that of the former. |
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