Paper Title:
A Calculation Model for the Film Thickness and Component Uniformity of Twin Co-Sputtering Target System
  Abstract

In the vacuum film coating field, the co-sputtering method by two or more targets has been widely used for coating the composite film consisted of a variety of component elements. In this paper, a typical co-sputtering system is studied which composes the twin round planar magnetron sputtering targets settled symmetrically and slantways towards a single flat substrate with self-rotation. A model is set up to describe the non-dimensional relationship between the film thickness and the structural parameters of co-sputtering system, such as distance of the substrate-to-target , symmetrical eccentricity , translation length and obliquity angle of target . On the assumption that the sputtered particles are emitted in the direction of cosine distribution and fly straightly without collision scattering, the depositing rate distribution, film thickness distribution, the utilization ratio of the target sputtering material, and the fluctuant ratio of the components from two targets are calculated. Some of simulating examples are given by use of Matlab software.

  Info
Periodical
Advanced Materials Research (Volumes 129-131)
Edited by
Xie Yi and Li Mi
Pages
218-223
DOI
10.4028/www.scientific.net/AMR.129-131.218
Citation
S. W. Zhang, L. Y. Hou, Y. C. Han, Y. H. Xie, "A Calculation Model for the Film Thickness and Component Uniformity of Twin Co-Sputtering Target System", Advanced Materials Research, Vols. 129-131, pp. 218-223, 2010
Online since
August 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Min Woo Park, Wang Woo Lee, Jae Gab Lee, Chong Mu Lee
Abstract:Chromium (Cr) films were deposited on plain carbon steel sheets by DC and RF magnetron sputtering as well as by electroplating. Effects of...
1695
Authors: Feng Gao, Qing Nan Zhao, Xiu Jian Zhao, Yu Hong Dong
Abstract:Silicon Nitride thin films were deposited on glass substrates by r.f. magnetron sputtering with a mixture gas of N2 and Ar. The properties of...
1391
Authors: Yin Qun Hua, Rui Fang Chen, Zhong Xiu Niu, Jie Yu
Abstract:Cu thin films were prepared by DC magnetron sputtering on Si substrate, and the resistivities change by adjusting its sputtering parameters....
540
Authors: Hui Zhi, Jing Lin, Bo Zhang
Chapter 2: Environment Friendly Packaging Material Technology
Abstract:The SiOx thin films for food packaging were deposited by RF magnetron sputtering physical vapor technology on the substrates of...
238
Authors: Ya Ping Han, Shao Ze Wang, Qing Wen Wang, Jin Xin Wang, Ming Hai Luo
Chapter 2: Advanced Construction Materials
Abstract:Thickness uniformity of film influences the properties of deposit films greatly by using magnetron sputtering. A magnetron sputtering model...
334