Paper Title:
Analyses of CMP Mechanism of NiP Substrate of Computer Hard-Disk with Alkali Slurry
  Abstract

In this paper, the chemical character of NiP substrate of computer disk is analyzed, the CMP kinetics processing is discussed to indicate that the chemical reaction is the slowest and the control process. By analyzing essentiality of slurry on NiP film CMP, it is indicated that the chemical component of slurry acts the important role in CMP. New type of alkali slurry for NiP substrate was prepared and its CMP mechanism is studied with alkali slurry. Strong complexation of complex agent improved selectivity of concave area and convex area to get higher removal rate. Low roughness is realized with small size and low hardness silica sol as abrasive.

  Info
Periodical
Advanced Materials Research (Volumes 129-131)
Edited by
Xie Yi and Li Mi
Pages
580-583
DOI
10.4028/www.scientific.net/AMR.129-131.580
Citation
B. M. Tan, X. H. Niu, N. Bian, H. H. Zhou, Y. L. Liu, "Analyses of CMP Mechanism of NiP Substrate of Computer Hard-Disk with Alkali Slurry", Advanced Materials Research, Vols. 129-131, pp. 580-583, 2010
Online since
August 2010
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Price
$32.00
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