Paper Title:
Dynamic Constitutive Relation of EMC
  Abstract

In this paper, dynamic properties of EMC were studied at different temperatures and different strain rates. Firstly EMC was investigated by quasi-static tests. Secondly a series of dynamic compressive experiments of EMC were conducted using the Split Hopkinson Pressure Bar (SHPB) at sectional height of strain rates. Thirdly EMC constants in ZWT model were determined from experiments. Corresponding measurements were conducted at temperatures ranging from 20°C to 160°C. The results indicate that the yield strength and flow stress of EMC increase remarkably with the increase of strain rate and it is shows that the assembled curve is fit good accordance with actual the experimental curve. However, the yield strength of EMC is a little change with the increase of temperature which is ranging from 20°C to 160°C.

  Info
Periodical
Advanced Materials Research (Volumes 129-131)
Edited by
Xie Yi and Li Mi
Pages
988-992
DOI
10.4028/www.scientific.net/AMR.129-131.988
Citation
B. Wang, T. Chen, X. F. Shu, "Dynamic Constitutive Relation of EMC", Advanced Materials Research, Vols. 129-131, pp. 988-992, 2010
Online since
August 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Meng Kao Yeh, In Shung Lee
Abstract:The delamination problem in plastic ball grid array electronic package was investigated analytically and experimentally. The ANSYS code was...
363
Authors: Yong Tae Park, Yoo Kyoung Whang, Joon Ki Hong, Kwang Yoo Byeon
Abstract:In a semiconductor packaging process, the warpage greatly has influenced the reliability of the package as well as the workability. The strip...
625
Authors: Song Lin Yi, Yong Dong Zhou, Zheng Bin He, Xiao Jiang Feng, Bi Guang Zhang
Abstract:Relationship among equilibrium moisture content (EMC), temperature and pressure was established under vacuum condition, and EMC regression...
645
Authors: I. Abdullah, Azman Jalar, Shahrum Abdullah, M.F. Rosle, Mohd Faridz Mod Yunoh
Abstract:In the last decade, failure of microelectronic devices has become a prominent field of research all across the world. The results of this of...
1273
Authors: M.F. Hamid, M.K. Abdullah, H. Yusoff, Sheikh Mohd Firdaus, Mohd Zulkifly Abdullah, Zulkifli Mohamad Ariff, M.A. Azmi
Chapter 4: Applied Mechanics, Design and Manufacturing
Abstract:3-D packaging is a technology that offers high density packaging and high performance. It enables chips to be stack in a single package and...
318