Paper Title:
Mechanical Properties and Experimental Study of a Composite Polishing Plate during Super-High Polishing
  Abstract

A new composite polishing plate for polishing of CVD diamond films has been designed. The displacement and stress distributions of the high speed rotation polishing plate have been investigated due to centrifugal forces, and the polishing mechanism of super-high polishing has been analyzed by using X-ray photo-electron spectroscopy. The results showed that the displacements both in axial and radial increase with the increasing of the rotational speed. When the rotation speed reached to 1200 rad/s, the von Mises equivalent stress is about 242 MPa, which is safe for the composite polishing plate. Additional, the polishing mechanism is mainly the chemical reaction between carbon and titanium during the super-high speed polishing. At elevated temperature, the chemical reaction between oxygen and titanium, oxygen and carbon can also occur.

  Info
Periodical
Edited by
Qiusheng Yan, Jiabin Lu, Jun Wang and Hang Gao
Pages
337-342
DOI
10.4028/www.scientific.net/AMR.135.337
Citation
L. Zhou, S. T. Huang, L. F. Xu, "Mechanical Properties and Experimental Study of a Composite Polishing Plate during Super-High Polishing", Advanced Materials Research, Vol. 135, pp. 337-342, 2010
Online since
October 2010
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