Paper Title:
Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture
  Abstract

The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.

  Info
Periodical
Edited by
Qiusheng Yan, Jiabin Lu, Jun Wang and Hang Gao
Pages
393-397
DOI
10.4028/www.scientific.net/AMR.135.393
Citation
W. B. Bi, P. Q. Ge, S.Q. Song, Y.F. Gao, Z.S. Wang, L. Zhang, "Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture", Advanced Materials Research, Vol. 135, pp. 393-397, 2010
Online since
October 2010
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