Paper Title:
Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process
  Abstract

The friction force on wafer surface plays an important role in removing material of wafer surface and the friction force on wafer surface may have a direct influence on non-uniformity of material removal in wafer CMP process. In this paper, models of friction force on wafer surface were built according to the CMP process. It is proved that the model of the friction force on the wafer surface is correct by the silicon wafer CMP Friction experiment. Then the data fitting of friction model has been done with the experimental data. By the friction force model, the within wafer nonuniformity (WIWNU) of friction force distribution on wafer surface has been obtained with different rotational speed of wafer and polishing pad. The research of this paper is helpful to further understanding the material removal mechanism in wafer CMP.

  Info
Periodical
Edited by
Qiusheng Yan, Jiabin Lu, Jun Wang and Hang Gao
Pages
90-95
DOI
10.4028/www.scientific.net/AMR.135.90
Citation
J. X. Su, Y. X. Zhang, J. X. Du, R. K. Kang, "Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process", Advanced Materials Research, Vol. 135, pp. 90-95, 2010
Online since
October 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jian Xiu Su, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin, X.J. Li, Y.B. Tian
Abstract:Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of...
26
Authors: Jian Xiu Su, Xue Liang Zhang, Xi Qu Chen, Jia Xi Du, Dong Ming Guo
Abstract:Right getting hold of the contact form between the wafer and the pad is the precondition of fully understanding the material removal...
254
Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Dong Ming Guo, Ren Ke Kang
Abstract:Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer. The nonuniformity of...
119
Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Xiu Ying Wan, Xin Ning
Abstract:In order to understand the material removal mechanism in the process of chemical mechanical polishing (CMP), the states of abrasives in the...
658
Authors: Sheng Fang Zhang, Jian Xiu Su, Jia Xi Du, Ren Ke Kang
Abstract:Chemical mechanical polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. In...
313