Paper Title:

The Reliability Analysis of a Vacuum Forming Mold for IC Packing Bag

Periodical Advanced Materials Research (Volume 136)
Main Theme Frontier in Functional Manufacturing Technologies
Edited by Dunwen Zuo, Hun Guo, Hongli Xu, Chun Su, Chunjie Liu and Weidong Jin
Pages 114-117
DOI 10.4028/www.scientific.net/AMR.136.114
Citation Wei Shin Lin, 2010, Advanced Materials Research, 136, 114
Online since October 2010
Authors Wei Shin Lin
Keywords IC Packing Bag, Plastic Carrier Tape, Reliability Analysis, Vacuum Forming Mold
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This article is pointed to the reliability analysis of the vacuum forming mold for plastic carrier tape. The reliability analysis of the vacuum forming mold was decided by the dimension specification of the plastic carrier tape. The reliability design of the vacuum forming mold was preceded according to the reliability requirement. After detail design of the parts which would be manufactured and assembled. The accuracy and performance of the mold had been tested subsequently. The reliability of the mold was conducted by the accuracy of the plastic carrier tape. Through series of inspections and analysis, all the dimension accuracy of the plastic carrier tape met the specification, and vacuum forming mold’s reliability level confirms to design requirement.