Paper Title:
Characteristic Recognition of IC Chip’s Micro-Topography Defects Based on Image Projection Transformation and Energy Optimization Modeling
  Abstract

For accurate inspecting the micro-topography defects of IC chip, characteristic recognizing method of topography defects based on image projection transformation and energy optimization modeling is presented. First the topography conjugate images have been obtained by high-definition CCD cameras from different space positions, and then we extracting the relative positions of several selected IC defect characteristic-points, through establishing the relationship of image projecting transformation these point’s absolute three-dimensional coordinates can be calculated and determined, with energy optimization modeling the controlling curves are fitted, and then the defect topography in each enclosing spatial region which constituted by these controlling curves is structured. Mathematical characteristics are established according to the topography model, after training and adjusting BP network repeatedly the topography defects can be characteristic-recognized, and the recognizing results are gotten. In this experiment the performance comparison and analysis are implemented in several typical recognizing methods of image characteristic, which prove this new method’s accuracy and reliability and provide new idea for following IC chip’s precise detection.

  Info
Periodical
Advanced Materials Research (Volumes 139-141)
Edited by
Liangchi Zhang, Chunliang Zhang and Tielin Shi
Pages
1990-1995
DOI
10.4028/www.scientific.net/AMR.139-141.1990
Citation
Z. W. Liang, C. L. Zhang, Y. J. Wang, Z. M. Xiao, "Characteristic Recognition of IC Chip’s Micro-Topography Defects Based on Image Projection Transformation and Energy Optimization Modeling", Advanced Materials Research, Vols. 139-141, pp. 1990-1995, 2010
Online since
October 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Sheng Hua Wang, Tie Bang Xie, Xu Dong Yang
Abstract:The surface topography characterization of MEMS device is very important to bonding technology of MEMS device. Motif characterizing method...
210
Authors: Hai Juan Ding, Li Bin Guo, Zhi Hang Zhang, Hai Cui
Abstract:The surface micro-topography of micro-WEDM is random, disordered and multi-scale and has been proved that it is fractal with the...
1273
Authors: Ze Fei Wei, Wen Ji Xu, Gui Bing Pang, Xu Yue Wang
Abstract:In this paper, surface topography characteristics of electrochemical mechanical finishing (ECMF) for steel was investigated. The scanning...
658
Authors: Mei Fa Huang, Xiong Cheng, Guang Qian, Jiang Tai Huang, Jing Zhang, Hui Jing
Abstract:With the development of science and technology, the higher and higher surface accuracy of workpiece is required. The characterization of...
34
Authors: Dong Liang Xu, Jian Zhang
Abstract:This paper presents a novel 3-D topography model for micro-manufacturing process simulations, which uses unit vector of the parametric...
477