Paper Title:
A Damage Cohesive Model for Simulating 90° Peel Propagation in Anisotropic Conducive Adhesive Bonding
  Abstract

A modified cohesive zone interface model that has a damage factor couple with the thermal cycle and humidity aging was proposed. The damage factor not only can change the cohesive zone strength acting but also can effect on the energies of separation. The modified cohesive zone interfacial model is developed and implemented in ABAQUS, as a user element subroutine, to simulate the peeling process for the specimen bonding by anisotropic conducive adhesive film (ACF) under the thermal cycle and humidity tests. Finite element explicit code and the constitutive relation of this element has been defined by the user-defined mechanical material behaviour (VUMAT). The bulk material element selected is a 4-node bilinear plane stress quadrilateral element, and the reduced integration and hourglass control are also adopted. The numerical simulated results accorded well to the experiments to illustrate the validity of the new model.

  Info
Periodical
Advanced Materials Research (Volumes 139-141)
Edited by
Liangchi Zhang, Chunliang Zhang and Tielin Shi
Pages
374-377
DOI
10.4028/www.scientific.net/AMR.139-141.374
Citation
J. Zhang, Z. Y. Zhao, X. L. Wei, "A Damage Cohesive Model for Simulating 90° Peel Propagation in Anisotropic Conducive Adhesive Bonding", Advanced Materials Research, Vols. 139-141, pp. 374-377, 2010
Online since
October 2010
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