Paper Title:
Forecasting and Parameters Optimization of Reflow Soldering Profile Based on BPNN and GA
  Abstract

This paper proposes an effective method to determine the optimal parameters settings of reflow soldering profile and helps reduce the try-and-error time in practical application. Due to the complex nonlinear relationship between reflow thermal profile and process parameters in this problem, BPNN is adopted to establish the model for description of this intricate relationship between inputs and outputs. According to the requirements of the reflow soldering profile, GA is used to calculate the best input parameters with its strong global research ability. Thus, a combined model with BPNN and GA is proposed for parameters optimization and contributes to reduction of decision time of input parameter for reflow soldering profile. In addition, a case study is given to prove the accuracy of the proposed method.

  Info
Periodical
Advanced Materials Research (Volumes 139-141)
Edited by
Liangchi Zhang, Chunliang Zhang and Tielin Shi
Pages
990-995
DOI
10.4028/www.scientific.net/AMR.139-141.990
Citation
E. S. Pan, Y. Jin, H. Xu, W. Z. Liao, "Forecasting and Parameters Optimization of Reflow Soldering Profile Based on BPNN and GA", Advanced Materials Research, Vols. 139-141, pp. 990-995, 2010
Online since
October 2010
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Price
$32.00
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