Paper Title:
Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film
  Abstract

The distributions of residual stresses for zinc-plated film were measured quantitatively by X-ray diffraction (XRD), its interfacial structures were observed with scanning electron microscope (SEM). The effects of residual stress on bonding strength of zinc-plated film were investigated, and its influence mechanism was discussed. The experimental results show that residual stresses of zinc-plated film are behaved as tensile stress, which increase with its thickness, bonding strength of zinc-plated film is inverse ratio with residual stresses; the effects of residual stress on film crack are obvious, tensile stress speeds film cracking, which decrease its bonding strength; bonding strength of zinc-plated film is increased by improving its residual stress distribution.

  Info
Periodical
Edited by
Hun Guo, Zuo Dunwen, Tang Guoxing
Pages
112-116
DOI
10.4028/www.scientific.net/AMR.142.112
Citation
X. F. Wang, "Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film", Advanced Materials Research, Vol. 142, pp. 112-116, 2011
Online since
October 2010
Authors
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Min Yang, Zeng Da Zou, Si Li Song, Xin Hong Wang
Abstract:In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum...
2435
Authors: Yasushi Fukuzawa, Shigeru Nagasawa, Masahiro Watanabe, Shigehiko Takaoka
Abstract:To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is...
443
Authors: Shu Xiang Song, Zhang Jian Zhou, Juan Du, Zhi Hong Zhong, Chang Chun Ge
Abstract:Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The...
425
Authors: Jun Zhang, Xu Chen, Xin Li Wei, Yong Cheng Lin
Abstract:The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to evaluate...
2875
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44