Paper Title:
Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant
  Abstract

An elastic co-film with excellent mechanical properties and adhesiveness, as well as good thermal conductivity, was fabricated based on the composition of a thermal-conductive alumina and ethylene vinyl acetate (EVA) copolymer. Thermal conductivity of the co-films with various particle sizes, amount, surface properties, and so on of alumina were investigated by the laser scattering method. The SEM results showed that the co-film with 16% (volume fractions) of submicron alumina in EVA copolymer had a good interface binding.

  Info
Periodical
Advanced Materials Research (Volumes 143-144)
Edited by
H. Wang, B.J. Zhang, X.Z. Liu, D.Z. Luo, S.B. Zhong
Pages
1454-1458
DOI
10.4028/www.scientific.net/AMR.143-144.1454
Citation
M. X. Shen, Y. X. Cui, Y. M. Zhang, "Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant", Advanced Materials Research, Vols. 143-144, pp. 1454-1458, 2011
Online since
October 2010
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Price
$35.00
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