Paper Title:
Preparation and Property of SnXCuNiBi Solder Alloy
  Abstract

Lead-free solder is meeting the requirement of environmental protection, but the property performance of existing lead-free solder is hardly comparable to those of lead solder. In this paper, 0.6% Bi was added into SnXCuNi solder alloy to produce lead-free solder at low cost and high performance. Microstructure, phase composition, melting point, wettability and characteristics of weld interface have been studied and analyzed. The results show that SnXCuNiBi solder alloy are mainly composed of βSn, SnX, Cu6Sn5 and SnBi. The addition of Bi reduces the melting point and improves the wettability of the solder. The main component of the joint interface of SnXCuNiBi/Cu system is Cu6Sn5, which has shown the capability to keep relatively high shear strength at the joint interface.

  Info
Periodical
Advanced Materials Research (Volumes 146-147)
Edited by
Sihai Jiao, Zhengyi Jiang and Jinglong Bu
Pages
485-490
DOI
10.4028/www.scientific.net/AMR.146-147.485
Citation
H. Y. Chen, X. H. Jie, H. Y. Zhang, Y. L. Chen, L. Guo, "Preparation and Property of SnXCuNiBi Solder Alloy", Advanced Materials Research, Vols. 146-147, pp. 485-490, 2011
Online since
October 2010
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Price
$32.00
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