Paper Title:
Study on Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy
  Abstract

The flow stress behavior of Cu-2.0Ni-0.5Si alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator.Dynamic recrystallization and dynamic recovery during high temperature deformation have been investigated by means of compression tests in the temperature and strain rate ranges of 873 to 1073 K and 0.01 to 5s-1 under maxium strain of 60%. The results show the flow stress was controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate.The hot deformation equation is e& = e28.47[sinh(0.013s )]5.52 exp(-245.4´103 / RT ) .

  Info
Periodical
Advanced Materials Research (Volumes 146-147)
Edited by
Sihai Jiao, Zhengyi Jiang and Jinglong Bu
Pages
701-704
DOI
10.4028/www.scientific.net/AMR.146-147.701
Citation
Y. Zhang, B. H. Tian, P. Liu, S. G. Jia, L. Fan, Y. Liu, "Study on Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy", Advanced Materials Research, Vols. 146-147, pp. 701-704, 2011
Online since
October 2010
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$32.00
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