Paper Title:
Microstructure Evolution of Directionally Solidified Al-Cu Alloys
  Abstract

The microstructure evolution of Al-Cu alloys with different compositions is investigated in directional solidification. Two distinctly different microstructure evolution mechanisms are obtained in Al-0.85%Cu and Al-4%Cu systems, respectively. In Al-0.85%Cu alloy, it shows a peculiar phenomenon, the microstructure evolution is always cells and no dendrites are obtained. In other words, the cells undergo several transitions as the pulling velocity increasing from 15μm/s to 300μm/s, they follow the sequences: mixed microstructure of pox and banded cells →mixed microstructure of polygonal and banded cells →banded cells →elongated cells. Particularly, it is studied what caused the dendrites not appear in Al-0.85%Cu system. Finally, it comes to the conclusion that there are two aspects which lead to the phenomenon: a dilute alloy composition and a relatively higher temperature gradient.

  Info
Periodical
Advanced Materials Research (Volumes 146-147)
Edited by
Sihai Jiao, Zhengyi Jiang and Jinglong Bu
Pages
729-733
DOI
10.4028/www.scientific.net/AMR.146-147.729
Citation
M. Qu, L. Liu, M. Zhao, F. B. Liu, G. P. He, "Microstructure Evolution of Directionally Solidified Al-Cu Alloys", Advanced Materials Research, Vols. 146-147, pp. 729-733, 2011
Online since
October 2010
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$32.00
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