Paper Title:
The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging
  Abstract

The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.

  Info
Periodical
Advanced Materials Research (Volumes 148-149)
Edited by
Xianghua Liu, Zhengyi Jiang and Jingtao Han
Pages
1108-1111
DOI
10.4028/www.scientific.net/AMR.148-149.1108
Citation
A. Jalar, Z. Kornain, R. Rasid, S. Abdullah, N. K. Othman, "The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging", Advanced Materials Research, Vols. 148-149, pp. 1108-1111, 2011
Online since
October 2010
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