Paper Title:

Study on High-Density-Copper Grain-Refining Cu-W Composites

Periodical Advanced Materials Research (Volumes 148 - 149)
Main Theme Manufacturing Processes and Systems
Edited by Xianghua Liu, Zhengyi Jiang and Jingtao Han
Pages 112-117
DOI 10.4028/www.scientific.net/AMR.148-149.112
Citation Dun Qiang Tan et al., 2010, Advanced Materials Research, 148-149, 112
Online since October, 2010
Authors Dun Qiang Tan, Qiang Chen, Fang Xin Yu, Wen Xian Li
Keywords Compact Pressure, Co-Reduction, High-Density-Copper Cu-W, Sintering Temperature
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Abstract

By detecting microstructures and properties of Cu-W composites, effects of powder composition, sintering temperature and compacting pressure on sintered billets were studied, and sintering mechanism of Cu-W powders was discussed. Effective rules of process parameters have been preliminarily obtained: Sintered billets of Cu-40W and Cu-50W had a low density when compacted at 200MPa, sintered below the melting point of copper, and density, hardness enlarged with sintering temperature increasing; Hardness, density, electrical conductivity of Cu-40W enlarged with compacting pressure when compacted above 600MPa, sintered at 1100C; But when compacted at 800MPa, sintered at 1100C, Cu-40W sintered billets had a density of 11.37g/cm3, relative density of 99.6%, closed to the theoretical value.