Paper Title:
Modeling and Simulation of Temperature Field of Nano-Zirconia Ceramics Precision Grinding
  Abstract

  Info
Periodical
Advanced Materials Research (Volumes 148-149)
Edited by
Xianghua Liu, Zhengyi Jiang and Jingtao Han
Pages
181-185
DOI
10.4028/www.scientific.net/AMR.148-149.181
Citation
Y. L. Hou, C. H. Li, G. Y. Liu, "Modeling and Simulation of Temperature Field of Nano-Zirconia Ceramics Precision Grinding", Advanced Materials Research, Vols. 148-149, pp. 181-185, 2011
Online since
October 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hiroyuki Hasegawa, Suritalatu, Moriaki Sakakura, Shinya Tsukamoto
Abstract:During the last decades, heat generation in grinding is one of the top concerns because high temperature under fabrication leads to less...
114
Authors: Wan Shan Wang, Chong Su, Tian Biao Yu, Li Da Zhu
Abstract:Based on virtual reality technology, a friendly human-computer interaction interface and virtual machining environment were developed by...
216
Authors: Bo Zhao, Jun Jin Ma, Ping Yan Bian, Yu Li
Abstract:In this paper the relationship of the efficiency of ultrasonic grinding and abrasive movement are studied. Ultrasonic grinding grain...
4103
Authors: Chong Lue Hua, Gui Cheng Wang, Hong Jie Pei, Gang Liu
Chapter 8: Modeling, Analysis, and Simulation of Manufacturing Processes
Abstract:Thermal stresses of grinding plays an important role on the fatigue and wear resistance of the component. A comprehensive analysis of thermal...
2211
Authors: Q.S. He, Y.C. Fu, Jiu Hua Xu, B.F. Zhang
Chapter 1: Material Properties and Manufacturing Technologies
Abstract:A three dimension heat transfer model, using a commercial code Fluent software which was based on FEM, was developed to describe the grinding...
156