Paper Title:
Slurry Preparation: A Key to Upgrade CMP Efficiency
  Abstract

Slurry preparation is of paramount importance in chemical mechanical planarization (CMP) process. It couples the combination effects of chemical and mechanical ones. In this paper, the characteristics of the slurry particles used in CMP are firstly modeled, which includes the size and the concentration with primary priority. And then, the model is validated by experiments during hard disk wafer polishing. The slurry prepared contributes to a high quality hard disk surface processed with CMP, which leads to low waviness Wa and roughness Ra with suitable material removal rate (MRR) as well. The study will surely lay a feasible foundation to the CMP mechanism.

  Info
Periodical
Advanced Materials Research (Volumes 148-149)
Edited by
Xianghua Liu, Zhengyi Jiang and Jingtao Han
Pages
19-24
DOI
10.4028/www.scientific.net/AMR.148-149.19
Citation
C. H. Zhang, H. Lei, X. L. Hu, "Slurry Preparation: A Key to Upgrade CMP Efficiency", Advanced Materials Research, Vols. 148-149, pp. 19-24, 2011
Online since
October 2010
Export
Price
$32.00
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