Paper Title:
Test of IGBT Transient Thermal Impedance and Modeling Research on Thermal Model
  Abstract

As the operation performances and reliability of semiconductor devices are tightly related to its operating temperature, the research on the heat transfer characteristic and thermal modeling do a significant meaning to extend services lifetime and improve application reliability of the IGBT modules. The physical structure and the conception, RC component network of thermal resistance, test principle and platform of the transient thermal impedance of IGBT module and three modeling methods are briefly introduced. The parameters of Cauer RC thermal network of a certain type IGBT is derived based on transmission line method. The junction-case thermal resistance can be deduced by Finite Element Method in the numerical simulator ANSYS and the transient thermal impedance curve. Thermal compact model can also be deduced from the numerical simulation and experimental results. An excellent agreement is obtained between experimental results derived by the transient thermal impedance curve and numerical simulation results based on FEM. The thermal compact model and experimental results could be helpful for modeling of thermal model and heat sink design for such electronic devices.

  Info
Periodical
Advanced Materials Research (Volumes 148-149)
Edited by
Xianghua Liu, Zhengyi Jiang and Jingtao Han
Pages
429-433
DOI
10.4028/www.scientific.net/AMR.148-149.429
Citation
M. Chen, Y. T. Yu, B. Wang, Y. Tang, "Test of IGBT Transient Thermal Impedance and Modeling Research on Thermal Model", Advanced Materials Research, Vols. 148-149, pp. 429-433, 2011
Online since
October 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jong Woong Kim, Sun Kyu Park, Seung Boo Jung
Abstract:Ball shear test was investigated in terms of effects of important test parameters, i.e. shear height and shear speed, with an experimental...
851
Authors: Chang Long Liu, Da Pei Tang
Abstract:Thermal residual stress in diamond film deposited onto Mo substrate was simulated and analyzed comprehensively by using the finite element...
1199
Authors: Mohsen Loh-Mousavi, Amir Masoud Mirhosseini, Ghasem Amirian
Abstract:In recent years, tube hydroforming has been applied in automobile and airplane industries, to decrease weight. In general, the determination...
5
Authors: Zhen Yin, Hua Li, Bang Fu Wang, Ke Feng Song
Innovative Design Methodology
Abstract:Based on FEM, a new type of ultrasonic elliptic vibrator design method was proposed, the ultrasonic elliptic vibration was achieved by the...
341
Authors: Zhi Lan Chen, Ren Wei Yang
Chapter 2: Simulation and Engineering Optimization
Abstract:The filling process, solidification process, gasification process and node temperature change of special-shaped stainless steel stirrer via...
479