Paper Title:
Numerical Modelling of Isothermal Solidification Time during Rolling -Diffusion Bonding Process
  Abstract

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Periodical
Advanced Materials Research (Volumes 15-17)
Edited by
T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran
Pages
543-548
DOI
10.4028/www.scientific.net/AMR.15-17.543
Citation
H. Li, J. T. Han, "Numerical Modelling of Isothermal Solidification Time during Rolling -Diffusion Bonding Process", Advanced Materials Research, Vols. 15-17, pp. 543-548, 2007
Online since
February 2006
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Price
$32.00
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