Paper Title:
Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits
  Abstract

Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.

  Info
Periodical
Advanced Materials Research (Volumes 15-17)
Edited by
T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran
Pages
599-603
DOI
10.4028/www.scientific.net/AMR.15-17.599
Citation
H. Saiki, Y. Marumo, H. Nishitake, M. Hazama, F. Sakata, "Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits", Advanced Materials Research, Vols. 15-17, pp. 599-603, 2007
Online since
February 2006
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$32.00
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