Paper Title:
Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple
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Periodical
Advanced Materials Research (Volumes 15-17)
Edited by
T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran
Pages
604-608
DOI
10.4028/www.scientific.net/AMR.15-17.604
Citation
J.B. Ryu, J. Y. Huh, H.S. Kim, S. J. Oh, "Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple", Advanced Materials Research, Vols. 15-17, pp. 604-608, 2007
Online since
February 2006
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