Paper Title:
Effect of Film Thickness on the Annealing Texture in Sputtered and Electroplated Cu Films
  Abstract

For optimum fabrication and usage of Cu films, an understanding of the relationship between processing and microstructure is required. The existence of twins is another significant factor for texture development in Cu films. Texture character and strength in the Cu film is dependent on the twin boundary development that is a function of processing conditions and film thickness. In this study, determination of grain growth and texture in the sputtered and electroplated Cu films during annealing was performed for films of 100, 480 and 850 nm in thickness deposited on a Ta(25 nm)/Si wafer. The texture was measured by X-ray pole figure. The effect of film thickness on the annealing texture in the sputtered and electroplated Cu films is examined and discussed.

  Info
Periodical
Advanced Materials Research (Volumes 15-17)
Edited by
T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran
Pages
982-988
DOI
10.4028/www.scientific.net/AMR.15-17.982
Citation
S. H. Lee, N. J. Park, D. P. Field, P. R. Besser, "Effect of Film Thickness on the Annealing Texture in Sputtered and Electroplated Cu Films", Advanced Materials Research, Vols. 15-17, pp. 982-988, 2007
Online since
February 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Wan Li Zhang, Hong Chuan Jiang, Bin Peng, Wen Xu Zhang, Shi Qing Yang
Abstract:In this paper, the influences of annealing temperature on TbFe magnetostrictive film magnetic and magnetostrictive characteristics were...
3741
Authors: Hiba Azzeddine, Djamel Bradai
Chapter 3: Deformation and Annealing
Abstract:The texture and microstructure after hot rolling and annealing of WE54 alloy was investigated using X-ray techniques and optical microscopy....
453
Authors: Ryusuke Nakamura, Takehiro Shudo, Akihiko Hirata, Manabu Ishimaru, Hideo Nakajima
Abstract:Formation behavior of nanovoids during the annealing of amorphous Al2O3 and WO3 was studied by transmission...
541
Authors: Jian Sheng Xie, Ping Luan, Jin Hua Li
Chapter 9: Composite Materials II
Abstract:Using magnetron sputtering technology, the CuInSi nanocomposite thin films were prepared by multilayer synthesized method. The structure of...
2770
Authors: Omar Abbes, Feng Xu, Alain Portavoce, Christophe Girardeaux, Khalid Hoummada, Vinh Le Thanh
Chapter 8: Diffusion in Electronic Materials
Abstract:An alternative solution for producing logic devices in microelectronics is spintronics (SPIN TRansport electrONICS). It relies on the fact...
439