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Soldering Properties of Sn-Zn-X Micro Solder Powders Fabricated by Melts Dispersion Technique

Journal Advanced Materials Research (Volumes 15 - 17)
Volume THERMEC 2006 Supplement
Edited by T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran
Pages 995-1000
DOI 10.4028/www.scientific.net/AMR.15-17.995
Citation Jeong Il Youn et al., 2006, Advanced Materials Research, 15-17, 995
Online since February, 2006
Authors Jeong Il Youn, Won Ha, Young Jig Kim
Keywords Lead-Free, Melts Dispersion Technique, Oxygen Concentration, Solder Powder, Tin-Zinc
Abstract

Melts dispersion technique is a new process to produce solder powders in oil surroundings by the formation of molten metal’s droplets. The entire viscosity of the fluid after uniform mixture of melts and oil mainly affected the shape and size of the solder powder. The size of solder powder was increased and the irregular shape was altered into the spherical shape with increasing the fluid viscosity. The effect of alloying elements, such as Mg, Al and Ti, on Sn-Zn solder for the oxidation resistance was investigated using the solder paste mixed solder powder fabricated by melts dispersion technique at optimum conditions and RMA type flux. The oxygen concentration was reduced by the addition of alloying elements, especially, by Ti adding.

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