Paper Title:
Toughening of Thermosetting Resins with Thermoplastic Polyimide: Thermal, Morphological, and Mechanical Characterization
  Abstract

Synthesize a thermoplastic polyimide (TP-PI) by 4, 4’-Bisphenol A dianhydride (BPADA) and 4, 4’-diaminodiphenyl ether(ODA) to toughen thermosetting polyimide(TS-PI) of BPADA and 3-aminophenylacetylene (APA) system. Improve the toughness of matrix resin by control morphology of blends. The results show that the system has been phase separation, TP-PI as a continuous phase, blends is part miscibility or immiscibility. Compose materials anysis show that the adhesion of resin and fiber have been improved, toughness of resin-based composite materials has been improved at the same time without sacrificing original thermal properties and modulus.

  Info
Periodical
Advanced Materials Research (Volumes 150-151)
Edited by
Jinglong Bu, Zhengyi Jiang and Sihai Jiao
Pages
1330-1335
DOI
10.4028/www.scientific.net/AMR.150-151.1330
Citation
D. M. Wang, X. G. Zhao, H. Jia, X. H. Yu, Q. M. Li, L. N. Wang, H. W. Zhou, G. D. Dang, C. H. Chen, "Toughening of Thermosetting Resins with Thermoplastic Polyimide: Thermal, Morphological, and Mechanical Characterization", Advanced Materials Research, Vols. 150-151, pp. 1330-1335, 2011
Online since
October 2010
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Price
$32.00
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