Paper Title:
Effects of RE on the Microstructure and Mechanical Properties of Electrodeposited Copper Foil
  Abstract

Electrodeposited copper foil was prepared by direct current electrodeposited method. Effects of different RE additions including 0, 3mg/L, 6mg/L and 9mg/L on the morphology, roughness, and mechanical properties of electrodeposited copper foil are investigated at high current density and high flow rate by SEM (scanning electron microscope), roughness measuring instrument, microcomputer control electronic universal testing machine and high temperature drawing machine. The results reveal that with increasing in RE content, the grain size in the copper foil is refined with more homogeneous distribution and denser, mechanical properties can be improved also. The desirable grain size in the copper foil with maximum value of the mechanical properties and the roughness can be obtained with approximately 6 mg/L RE content.

  Info
Periodical
Advanced Materials Research (Volumes 150-151)
Edited by
Jinglong Bu, Zhengyi Jiang and Sihai Jiao
Pages
68-71
DOI
10.4028/www.scientific.net/AMR.150-151.68
Citation
T. He, G. B. Yi, F. M. Cai, W. Y. Peng, X. J. Yang, "Effects of RE on the Microstructure and Mechanical Properties of Electrodeposited Copper Foil", Advanced Materials Research, Vols. 150-151, pp. 68-71, 2011
Online since
October 2010
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$35.00
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