The particle-reinforced composite solder is prepared by adding 1 μm Ag, 1 μm Ni and 8 μm Cu into Sn0.7Cu eutectic solder which serve as the base material in current research. The formation of a thin layer of intermetallics around the particle-reinforced will promote the closer integration between base-solder and particle-reinforced, and thus form the particle-reinforced composite solder. The appropriate reinforcement particles were selected and the effects of reinforcement particles on physical properties, mechanical properties and solderability of the composite solder were studied. The spreading property of Ni (3 vol %) particle-reinforced Sn0.7Cu based composite solder was the worst among Sn0.7Cu based composite solders. The spreading property of the Cu particle-reinforced Sn0.7Cu based composite solder was worse than those of Ag particle-reinforced Sn0.7Cu based composite solders. So the conclusion is drawn that Ag particles are considered as the most appropriate reinforced particles for Sn0.7Cu based composite solders.