Paper Title:
Investigation for Test Sensitivity of Shearography
  Abstract

To reduce weight and improve strength in the aerospace industry, composite structure connected by glue has gained popularity as a replacement for conventional materials and structures. However, the adhesive bonding process is more susceptible to quality variations during manufacturing than traditional joining methods. The integrality, strength and rigidity of product would be broken by disbonding. Investigate the sensitivity and accuracy of the testing method was more impotent to ensure the product quality and testing efficiency. This paper presents a study of detecting sensitivity of sheargoraphy methods when it is used for inspecting disbondinging on honeycomb structures. The potential of shearography method is also outlined.

  Info
Periodical
Advanced Materials Research (Volumes 152-153)
Edited by
Zhengyi Jiang, Jingtao Han and Xianghua Liu
Pages
86-89
DOI
10.4028/www.scientific.net/AMR.152-153.86
Citation
H. J. Li, L. X. Cai, "Investigation for Test Sensitivity of Shearography", Advanced Materials Research, Vols. 152-153, pp. 86-89, 2011
Online since
October 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Kun Nan Xiao, Jia Li, Qing Guan Chen, Kai Meng
Abstract:The detection of raw silk defects is important in the quality inspection of raw silk. Electronic inspection is a popular method now for the...
429
Authors: R.C. Waugh, Janice M. Dulieu-Barton, S. Quinn
Abstract:The feasibility of using pulse phase thermography (PPT) to identify defects in adhesively bonded joints is assessed. Artificial defects...
369
Authors: Lin Liu, Qiang Wang, Kai Guo, Yan Xu, Shi Long Jia
Chapter 3: Measuring Technology and Mechatronics
Abstract:The quality criterion and engineering application of defects detection of complex joints of steel reinforced concrete (SRC) structure by...
1691
Authors: Jing Xie, Chang Hang Xu, Guo Ming Chen
Chapter 5: Measurements, Monitoring and Sensor
Abstract:We propose an infrared thermal image processing framework based on a modified fuzzy c-means clustering algorithm with revised similarity...
1356