Paper Title
Page
Authors: Xiao Yan Long, Xue Gang Luo, Neng Wu Zou, Yong Hong Ma
Abstract:Konjac Glucomannan(KGM) was denatured by Carboxylmethylation to prepare Carboxymethyl konjac glucomannan(CMKGM) as coating material of...
1712
Authors: Fu Bin Liu, Man Yao, Peng Bo Zhang, Ji Jun Zhao
Abstract:The temperature and strain distributions of the mockup composed of Be, Cu-alloy with distinct structural material (SS316L and China Low...
1716
Authors: Qing Duan Meng, Qing Song Lin, Xiao Lei Zhang, Wei Guo Sun
Abstract:Two-step method is used to research stress and its distribution in 64×64 InSb infrared focal plane array (IRFPA) employing finite element...
1721
Authors: An Na Wang, Li Gen Wu, Lin Lu Jia, Xiu Ling Li, Yu Dan Sun
Abstract:Tea polyphenol loaded alginate-chitosan microspheres were prepared by ionic gelation method for controlling tea polyphenol release by using...
1726
Authors: Li Gen Wu, An Na Wang, Lin Lu Jia, Xiu Ling Li, Yu Dan Sun, Xiang Ying Xu
Abstract:Two fractions, such as Fr1-3 and Fr2-2, were obtain after separating and purifing crude kiwifruit glycoprotein by using Sepharose Cl-6B gel...
1730
Authors: Hong Xin Wang, Zheng Xiang Xue, Mei Hong Wei, Deng Long Chen, Min Li
Abstract:As a new biomaterial, recombinant spider silk protein has attracted much attention in tissue engineering. The pNSR-16/ BL21(DE3)pLysS strains...
1734
Authors: Zheng Liu, Xiao Mei Liu, Wei Min Mao
Abstract:The semi-solid A356 alloy slurry is prepared by slightly electromagnetic stirring with Ti-based refiner. The effects of the refiner on the...
1745
Authors: Li Yang, Gang Li
Abstract:To improve the wear resistance of ductile cast iron, plasma beam remelt-solidified hardening on the surface is adopted. Scanning electron...
1751
Authors: Yan Li, Jie Qi, Rui Rui Fan, Chuan Xin Zhai, Chun Hua Xu
Abstract:TiNbSn alloy has high specific strength, low modulus of elasticity, excellent corrosion resistance, no side effects, such as toxic and...
1755
Authors: Li Yang, Na Zhang
Abstract:The particle-reinforced composite solder is prepared by adding 1 μm Ag, 1 μm Ni and 8 μm Cu into Sn0.7Cu eutectic solder which serve as the...
1759
Showing 341 to 350 of 380 Paper Titles