Paper Title:
Study of Immersion Tin Plating on Copper by Galvanic Couple Current Method
  Abstract

Immersion tin (I-Sn) coatings on copper were prepared in a stannous methanesulfonate bath with thiourea being the potential altering agent. The electrochemical displacement process was studied by the galvanic couple current method (GCCM) on an electrochemical workstation. The morphology of the I-Sn coatings were observed by field-emission-gun scanning electron microscopy (FEG-SEM). The I-Sn process can be divided into three stages: (i) rapid increase in galvanic current, (ii) sudden decrease in galvanic current after a peak current, and (iii) low or residual galvanic current stages. It is demonstrated that the galvanic current method is a useful and efficient tool to identify the optimum ending time of the immersion plating process. This optimum immersion time results in a smooth and conformal deposit with a fine grain size.

  Info
Periodical
Advanced Materials Research (Volumes 154-155)
Edited by
Zhengyi Jiang, Xianghua Liu and Jinglong Bu
Pages
1053-1058
DOI
10.4028/www.scientific.net/AMR.154-155.1053
Citation
X. H. Liu, D. Tang, S. X. Wen, "Study of Immersion Tin Plating on Copper by Galvanic Couple Current Method", Advanced Materials Research, Vols. 154-155, pp. 1053-1058, 2011
Online since
October 2010
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Price
$35.00
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