Paper Title:
Growing Model of Interfacial Layer between Alloy Layer and Matrix in Diffusion Process of Hot Dip Aluminized Steel
  Abstract

Intermetallic compounds layer will be formed at the interfaces between alloy layer and matrix in the diffusion process of hot dip aluminized steel, which is beneficial to enhance the binding ability of alloy layer with matrix. However, when the thickness of intermetallic compounds exceeds the certain value, the vast extending force of interfacial void will cause the crack of intermetallic compounds and greatly weaken the spall resistance of aluminized layer. Therefore it is very important for the applications of hot dip aluminized steel to research and control the formation of intermetallic compounds at the interfaces. According to the characteristics of diffusion process of hot dip aluminized steel, the growing model of intermetallic compounds were established in the paper. The computed results were in accord with the experimental value. It can provide reference to the choice of the diffusion parameters of hot dip aluminized steel.

  Info
Periodical
Advanced Materials Research (Volumes 154-155)
Edited by
Zhengyi Jiang, Xianghua Liu and Jinglong Bu
Pages
1203-1208
DOI
10.4028/www.scientific.net/AMR.154-155.1203
Citation
W. Zhang, S. J. Fang, L. X. Li, "Growing Model of Interfacial Layer between Alloy Layer and Matrix in Diffusion Process of Hot Dip Aluminized Steel", Advanced Materials Research, Vols. 154-155, pp. 1203-1208, 2011
Online since
October 2010
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