In this paper we have presented an assembly unit equipped with electrothermally actuated microclamps (MCs), piezoelectric pad and rotary table to provide an environment for micropositioning and microclamping of submilimeter parts. The structural material of the system is considered to be <100> oriented Si with 20 µm thickness. Activating MCs, two approaches performed in the simulation procedure and results showed that utilizing 140 nm deposited Chromium thin layer on the U-shape structure as active material, reduces the overall input voltage and temperature in comparison with direct applying of potential difference to Si structure. To obtain more realistic results, both of these methods are simulated using finite element software in line with considering temperature-dependent thermophysical properties for structural and active material due to high operating temperatures. Design strategies and other advantages of using thin layer of chromium as active material are highlighted in the text.