Paper Title:
Control Factor Selection and Solder Residue Problem Study in Flip Chip Process
  Abstract

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Periodical
Advanced Materials Research (Volumes 154-155)
Edited by
Zhengyi Jiang, Xianghua Liu and Jinglong Bu
Pages
1804-1812
DOI
10.4028/www.scientific.net/AMR.154-155.1804
Citation
J. L. Kuo, C.-C. Kuo, "Control Factor Selection and Solder Residue Problem Study in Flip Chip Process", Advanced Materials Research, Vols. 154-155, pp. 1804-1812, 2011
Online since
October 2010
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