Paper Title:
Low-Temperature Property of New Type Lead-Free Solder Sn-X-Cu-Ni
  Abstract

Used periodic table of elementsⅤA first group elements X, Ni instead of Sn-Ag-Cu series Ag to prepare a new type of lead-free solder SnX4.5Cu1.5Ni.Studied this solder and the welded joint microstructure under the low temperature environment performance compared with SnAg3.0Cu0.5 and Sn63Pb37. The results show that: the electrical conductivity of SnX4.5Cu1.5Ni under low and normal temperature was greater than that of Sn63Pb37.The tensile and shear strength of them decreased when the temperate decreased, however the strength then improved when the temperature dropped to -20 . In addition, SnX4.5Cu1.5Ni was ductile fracture, Sn63Pb37 was brittle fracture and SnAg3.0Cu0.5 was mixed fracture at low temperature.

  Info
Periodical
Advanced Materials Research (Volumes 154-155)
Edited by
Zhengyi Jiang, Xianghua Liu and Jinglong Bu
Pages
371-375
DOI
10.4028/www.scientific.net/AMR.154-155.371
Citation
L. Yang, X. H. Jie, L. Guo, "Low-Temperature Property of New Type Lead-Free Solder Sn-X-Cu-Ni", Advanced Materials Research, Vols. 154-155, pp. 371-375, 2011
Online since
October 2010
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Price
$32.00
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