The present analysis combines the injection molding software Moldflow and the structural analysis software ABAQUS to study the thermal warping behavior induced by soldering process for FPC connecter. Due to the residual stress, the anisotropic material property and complexity of part geometry existed in the injected plastic housing of connector, thermal warping is induced by the circle thermal process as the FPC connector are soldered on mother board. In the present paper, the warping caused by injection molding process is modeled and simulated by Moldflow. Then, the residual stress, the anisotropic material property caused by different fiber orientation calculated by Moldflow are imported into ABAQUS as initial conditions through the Moldflow-ABAQUS interface module to evaluate the thermal warping caused by soldering process for FPC connecter. The crucial soldering process parameters have been identified and the Moldflow-ABAQUS simulation results are compared with the experimental results.