Paper Title:
Effect of RE on Microstructure and Interfacial Reactions of SnAgCu Solder
  Abstract

Effect of rare earth content on microstructure and interfacial reactions of low Ag content SnAgCu solder is researched by adopting the X-ray diffraction, JSM-5610LV scanning electronic microscope, energy spectrum analysis and JEM2100 ultrahigh resolution electron microscopy. The results show that proper quantities of rare earth (0.1%) can refine the eutectic microstructure of the solder alloy; and petal-like rare earth compound can be found in the solder alloy while the rare earth addition is 0.5%. The growing rate of the interfacial intermetallic compound can be reduced during the soldering with adding 0.1% rare earth in the Sn2.5Ag0.7Cu solder alloy.

  Info
Periodical
Advanced Materials Research (Volumes 154-155)
Edited by
Zhengyi Jiang, Xianghua Liu and Jinglong Bu
Pages
87-90
DOI
10.4028/www.scientific.net/AMR.154-155.87
Citation
Y. L. Wang, K. K. Zhang, G. J. Zhao, L. J. Han, "Effect of RE on Microstructure and Interfacial Reactions of SnAgCu Solder", Advanced Materials Research, Vols. 154-155, pp. 87-90, 2011
Online since
October 2010
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$32.00
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