Paper Title:
Research and Manufacture of Nano-Silver Conductive Ink
  Abstract

Printing electronics technology promotes the application of conductive ink. In this paper, the manufacture of nano-sliver conductive ink is investigated. First, Spherical silver nano-particles were reduced from silver nitrate solution by liquid chemical reduction method, with hydrazine hydrate as reductant and PVP as surface-protection reagent. SEM was used to characterize the morphology of silver powders, and the mean particles size is 62.79 nm. Then, conductive ink was prepared with nano-silver particles made in this research as conductive fillers, polyurethane resin and acrylic resin as binders, and stearic acid as dispersant. In the last, the conductive ink was printed on the PCB substrate by screening printing. After the ink is dried, conductivity, abrasion resistance, and adhesion were tested. The experiment results shows that the order of sheet resistivity magnitude is 10-4Ω•m, the number of rubbing fastness is more than 6000, and the adhesion can be resisted repeatedly to tape tear.

  Info
Periodical
Edited by
OUYANG Yun, XU Min and YANG Li
Pages
405-408
DOI
10.4028/www.scientific.net/AMR.174.405
Citation
B. L. Tang, G. X. Chen, Q. F. Chen, J. L. Tai, "Research and Manufacture of Nano-Silver Conductive Ink", Advanced Materials Research, Vol. 174, pp. 405-408, 2011
Online since
December 2010
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Price
$35.00
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